Si3N4 ceramic substrate has been widely used in electronic packaging field. Due to its excellent thermal conductivity, insulation and mechanical strength, Si3N4 ceramic substrates are often used as the base material for manufacturing large-scale integrated circuits and sealing. In addition, it is suitable for the packaging of high-performance modules, especially in applications requiring high power density, high chip temperature and high reliability. The long service life and high reliability of the Si3N4 substrate can meet the high requirements of modern electronic equipment ‌

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Established in 2015, Jiaozuo Jinchuan Electronic Technology Co., Ltd., located in Jiaozuo City, Henan Province, is a customized production enterprise from powder to device research and development. Now it has an annual production capacity of nearly 1,000 tons of electronic ceramic powder and 20 million ceramic substrates, and independently develops more than 10 kinds of microwave dielectric materials. Focus on the development of high-end technologies and products of wireless communication components. As an important device of military products, 5G base stations and the Internet of Things, we have broken through technical barriers, and technical transformation has fully guaranteed the reliability of products.

The company is a national high-tech enterprise, director of Jiaozuo Demonstration Engineering Center and China Electronic Components Industry Association. It has won the first prize of Jiaozuo City in the Innovation and Entrepreneurship Competition organized by the Science and Technology Bureau and the People's Social Security Bureau, and passed the ISO9001 quality management system certification, ISO14001 environmental management system certification and ISO45001 occupational health management system certification. At the same time, Jinchuan Electronics and Henan Polytechnic University set up a "postgraduate experimental practice demonstration base" to build a technology transfer center with national influence, promote the in-depth cooperation between government and enterprises, jointly carry out research, jointly build an innovation platform, join hands in opening up innovation, share scientific and technological resources, and actively create an efficient and collaborative innovation ecology without walls and seek common development.